APCO 2P01 Study Guide - Final Guide: Cosc, Voip Phone, Optical Fiber

• School: Brock University
• Department: Applied Computing
• Course: APCO 2P01
• Professor: Dave Bockus

Document Summary

2 functions: act as a communications device between cpu and i/o, acts as a resource management. Three ways to configure the motherboard: dip switches, jumpers, cmos ram. Sockets: pin grid array (pga) socket. Pins aligned in uniform rows around socket: land grid array (lga) Examples of lga sockets: lga775 and lga1366: flip-chip land grid array (fclga) socket. Chip is flipped over so that the top of the chip is on the bottom and makes contact with the socket: staggered pin grid array (spga) Squeezes more pins into a small space. Easily bent: ball grid array (bga) All current sockets are zero insertion force (zif) It is (cid:271)asi(cid:272)all(cid:455) a di(cid:272)tator of (cid:449)hat ra(cid:374)ge of cpu"s (cid:449)ill (cid:271)e (cid:272)o(cid:373)pati(cid:271)le socket. Bus carries 4 types of cargo: power, control signals, memory addresses and data. Bus specs: pci, pcix (express, agp. External connectors: usb, ps2, sound, video, network, serial/parallel (15 pin connectors) Less known include 3com, real tek: modem.